Process Capability
Items | Manufacturing Capability | |
Layer | 24 Layer | |
Size(mm) | Max. Size(mm) | 460mm*590mm |
Min. Thickness Spec. | Min. Thickness( Single/ Double) | 0.2mm |
Min. Thickness(4 Layers) | 0.4mm | |
Min. Thickness(6 Layers) | 0.6mm | |
Min. Thickness(8 Layers) | 0.8mm | |
Min. Thickness(10 Layers) | 1.0mm | |
Min. Thickness(12 Layers) | 1.2mm | |
Material | FR4 94-V0 (Standard) | TG140,TG150,TG180,TG200 |
Copper (UNIT:OZ) |
Max. Inner Layer Copper Thickness | 4oz |
Min. Inner Layer Copper Thickness | 0.5oz | |
Max. Outer Layer Copper Thickness | 5 oz(finished) | |
Min. Out Layer Copper Thickness | 0.3 oz( base copper) | |
Inner Board | Thinnest inner layer thickness (excluding copper thickness) mm | 3mil(0.075mm) |
Copper (oz) | 0.5oz | |
Inner Layer | The smallest inner hole isolation hole ring (mm) | 6mil |
Minimum distance from drill hole to inner wiring (mm) | 6mil | |
Inner layer etching | Alignment between layers (+/- %) | ±3mil |
Inner line width tolerance (+/-%) | ±20% | |
Drill hole | Minimum aperture (mm) | 0.2mm |
Drilling deviation ( +/- mm) | ±3mil | |
PTH Aperture tolerance (+/- mm) | ±3mil,press fit hole ±2mil | |
N-PTH Aperture tolerance (+/-mm) | ±2mil | |
Copper plating | Surface copper (oz) | 1oz |
Hole copper (mm) | 0.020mm | |
Tolerance (+/- %) | N/A | |
Outer layer etching | Line width tolerance +/-% | ±20% |
Solder mask | Color | Red/green/blue/yellow/white/purple/black |
Minimum solder dropout mm | 0.1mm | |
Solder mask pad mm | 0.2mm | |
Solder mask thickness (upper and lower limit) | 0.01mm~0.0254mm(double coating) | |
Maximum plug hole diameter mm | 0.5mm | |
Through hole (plug hole) | Solder mask ink as plug hole | |
Solder mask alignment mm | 0.05mm | |
Legend | Color | Color |
Traverse degree mm | 0.127mm | |
Minimum ink line width mm | 0.1mm(Partial) | |
Minimum character height/width mm | 0.8mm | |
Text paint thickness (upper and lower limit) | N/A | |
Electricity test | AOI System / Flying Probe Test | YES |
System open/short circuit (Yes or No) | YES | |
Differential impedance control | Single-ended impedance control 2L | YES |
Single-ended impedance control 4L | YES | |
Single-ended impedance control 6L | YES | |
Single-ended impedance control 8L | YES | |
Differential impedance control | YES | |
Forming | Forming reaming +/-mm | ± 0.127mm |
CNC Forming tolerance +/- mm | ± 0.127mm | |
V-Cut depth +/- mm | 1/3 Thickness | |
V-Cut angle | 30/45/60 Degree (standard 30 degrees) | |
V-Cut Deviation +/-mm | ±0.1mm | |
Half round hole | YES | |
Line configuration | Minimum distance between SMD line and line center | 0.4mm |
Minimum SMD PAD line width | 0.2mm | |
The distance between BGA's PAD and VIA hole edge | 0.2mm | |
Spray tin | Spray tin thickness mm | 120u" |
Flatness of spray tin mm | NA | |
Vertical spray tin ( Y or N) | YES | |
Horizontal spray tin ( Y or N) | NO | |
Surface treatment | Lead-free spray tin (Y OR N) | YES |
Immersion gold (Y or N) | YES | |
Immersion Silver ( Y or N) | YES | |
OSP (Y or N) | YES | |
Electroplating gold finger | YES | |
Other | UL | V0-1、V0-7 |
Date Code | YYWW 或 WWYY | |
Inner Layer | Minimum line width/line spacing (0.5oz) finished copper thickness | 3mil / 3.5mil |
Minimum line width/line spacing (1oz) finished copper thickness | 3mil / 4mil | |
Minimum line width/line spacing (2oz) finished copper thickness | 6mil / 6mil | |
Minimum line width/line spacing (3oz) finished copper thickness | 8mil / 9mil | |
Minimum line width/line spacing (4oz) finished copper thickness | 12mil / 12mil | |
Inner line width tolerance | +/-20% | |
Outer Layer | Minimum line width/line spacing (1oz) finished copper thickness | 3mil / 4mil |
Minimum line width/line spacing (2oz) finished copper thickness | 6mil / 6mil | |
Minimum line width/line spacing (3oz) finished copper thickness | 8mil / 9mil | |
Minimum line width/line spacing (4oz) finished copper thickness | 12mil / 12mil | |
Minimum line width/line spacing (5oz) finished copper thickness | 15mil / 15mil | |
Line width tolerance | +/-20% |