1. Reduce installation size, installation weight, installation time and installation errors, and reduce installation costs.
2. Replace point-to-point wire, with circuit dynamic deflection performance.
3. Multi-layer structure Z-axis direction interconnection, anisotropic interconnection bonding function.
4. Control the transmission of impedance signals, provide signal integrity, and achieve the function of high-speed cable structure.5. With single-layer board, double-sided board, multi-layer board and other circuit structures.
Such as: Mobile phone camera modules, Bluetooth headsets, NB camera modules, Battery modules, Optical lens modules, SSD, etc.