Capability

Process Capability

Items Manufacturing Capability
  Layer 24 Layer
Size(mm) Max. Size(mm) 460mm*590mm
Min. Thickness Spec. Min. Thickness( Single/ Double) 0.2mm
Min. Thickness(4 Layers) 0.4mm
Min. Thickness(6 Layers) 0.6mm
Min. Thickness(8 Layers) 0.8mm
Min. Thickness(10 Layers) 1.0mm
Min. Thickness(12 Layers) 1.2mm
Material FR4 94-V0 (Standard) TG140,TG150,TG180,TG200
Copper
(UNIT:OZ)
Max. Inner Layer Copper Thickness 4oz
Min. Inner Layer Copper Thickness 0.5oz
Max. Outer Layer Copper Thickness 5 oz(finished)
Min. Out Layer Copper Thickness 0.3 oz( base copper)
Inner Board Thinnest inner layer thickness (excluding copper thickness) mm 3mil(0.075mm)
Copper (oz) 0.5oz
Inner Layer The smallest inner hole isolation hole ring (mm) 6mil
Minimum distance from drill hole to inner wiring (mm) 6mil
Inner layer etching Alignment between layers  (+/-  %) ±3mil
Inner line width tolerance (+/-%) ±20%
Drill hole Minimum aperture (mm) 0.2mm
Drilling deviation  ( +/-  mm) ±3mil
PTH Aperture tolerance  (+/-  mm) ±3mil,press fit hole ±2mil
N-PTH Aperture tolerance  (+/-mm) ±2mil
Copper plating Surface copper  (oz) 1oz
Hole copper  (mm) 0.020mm
Tolerance   (+/- %) N/A
Outer layer etching Line width tolerance    +/-% ±20%
Solder mask Color Red/green/blue/yellow/white/purple/black
Minimum solder dropout   mm 0.1mm
Solder mask pad    mm 0.2mm
Solder mask thickness (upper and lower limit) 0.01mm~0.0254mm(double coating)
Maximum plug hole diameter  mm 0.5mm
Through hole (plug hole) Solder mask ink as plug hole
Solder mask alignment    mm 0.05mm
Legend Color Color
Traverse degree   mm 0.127mm
Minimum ink line width  mm 0.1mm(Partial)
Minimum character height/width  mm 0.8mm
Text paint thickness (upper and lower limit) N/A
Electricity test AOI System / Flying Probe Test YES
System open/short circuit  (Yes or No) YES
Differential impedance control Single-ended impedance control   2L YES
Single-ended impedance control 4L YES
Single-ended impedance control 6L YES
Single-ended impedance control 8L YES
Differential impedance control YES
Forming Forming reaming  +/-mm ± 0.127mm
CNC Forming tolerance  +/- mm ± 0.127mm
V-Cut depth    +/- mm 1/3 Thickness
V-Cut angle 30/45/60 Degree (standard 30 degrees)
V-Cut Deviation  +/-mm ±0.1mm
Half round hole YES
Line configuration Minimum distance between SMD line and line center 0.4mm
Minimum SMD PAD line width 0.2mm
The distance between BGA's PAD and VIA hole edge 0.2mm
Spray tin Spray tin thickness   mm 120u"
Flatness of spray tin  mm NA
Vertical spray tin ( Y or N) YES
Horizontal spray tin  ( Y or N) NO
Surface treatment Lead-free spray tin   (Y OR N) YES
Immersion gold (Y or N) YES
Immersion Silver ( Y or N) YES
OSP  (Y or N) YES
Electroplating gold finger YES
Other UL V0-1、V0-7
Date Code YYWW 或 WWYY
Inner Layer Minimum line width/line spacing (0.5oz) finished copper thickness 3mil / 3.5mil
Minimum line width/line spacing (1oz) finished copper thickness 3mil / 4mil
Minimum line width/line spacing (2oz) finished copper thickness 6mil / 6mil
Minimum line width/line spacing (3oz) finished copper thickness 8mil / 9mil
Minimum line width/line spacing (4oz) finished copper thickness 12mil / 12mil
Inner line width tolerance +/-20%
Outer Layer Minimum line width/line spacing (1oz) finished copper thickness 3mil / 4mil
Minimum line width/line spacing (2oz) finished copper thickness 6mil / 6mil
Minimum line width/line spacing (3oz) finished copper thickness 8mil / 9mil
Minimum line width/line spacing (4oz) finished copper thickness 12mil / 12mil
Minimum line width/line spacing (5oz) finished copper thickness 15mil / 15mil
Line width tolerance +/-20%
History
    3Inquiry