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Technology
Technology in EW Electronics
Highly specialized equipment and advanced manufacturing processes so that we can reliably produce printed circuit boards with the following characteristics
Customer Electonics
  • .Slim and light printed circuit boards
  • .Complex interconnect structure
  • .Smaller geometry graphic (Wire、Vias、Pad..etc)
  • .Thin laminated sheet
  • .Rigid, flexible, rigid-flex structure
Infrastructure electronic products
  • .Large and thick printed circuit boards
  • .Lofty signal / low dielectric loss material
  • .A variety of materials mixed compression structure
  • .Thermal management / metal core / buried piece
     of metal applications
  • .The buried active and passive components
  • .Blind Via/Via in Pad/Back drilling process
  • .High Aspect Ratio
Equipment
Laminate
X-Ray
Drilling
DF
Etching
AOI
Solder Mask
Silk screen
CNC
V-CUT
2D
E-Test
Inspection
Packing